Virtual Reality Wireless Experiences
June 17, 2022
VIREWIRX and The VOID took the stage at AWE USA 2022 with Vice President of XR, Serafin Diaz, joining The VOID’s CTO Steve Duckworth at the Santa Clara Convention Center on June 3, 2022 to share how we’re collaborating to create the most immersive VR experience possible today.
As a location-based entertainment VR experience, The VOID needed a technology partner who could support its vision of hyper reality: “the practical illusion of an impossible reality so convincing that the mind accepts it as reality.”
When an immersive experience takes on all or most of a person’s senses, it becomes a new dimension. A large amount of creativity goes into architecting a dimension (characters, story line, visual, sound and touch feedback). A large amount of compute also goes into rendering such a dimension into reality (high quality sound and graphics, tracking) on top of the ingenious instrumented space where such dimension exists. Previously, the rendering of sounds and visuals of a dimension were limited to the amount of compute a person could carry. Through compute offloading with high bandwidth, low latency wireless technologies, VIREWIRX is removing such limitations. New dimensions can quickly utilize what state-of-the-art compute and rendering technologies can deliver with the potential of shortening development and deployment cycles.
Watch as Diaz and Duckworth share how The VOID and VIREWIRX are able to deliver a new level of immersive VR experience and how VIREWIRX moves the compute to the edge of the network so users are able to roam freely wearing only a lightweight VR headset equipped with VIREWIRX’s small antenna and additional haptic device.
Seeking a technology partner to bring your VR experience to life? We’ve developed the state-of-the-art in Wireless XR combining our 60GHz unlicensed wireless XR system with split rendering process. We want to hear from you. Contact us today.
We are proud to offer a competitive package of benefits to our Bangalore-based team members that includes coverage for you and the people closest to you:
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XCOM Labs Vice President of Wireless Tamer Kadous is another engineering leader who was previously at Qualcomm and has more than 20 years of experience in wireless communications spanning the areas of PHY, MAC and upper layers. He has been a design architect, systems lead and project lead for a variety of projects including UMB (ultra-mobile broadband), WLAN, EV-DO, LTE, LTE-U, MulteFire and 5G NR. Tamer led the first effort for LTE-unlicensed design, implementation, and commercialization. He pioneered wireless machine learning algorithms and has almost 200 US granted patents. He was Chairman of the Radio Working Group and board member in the MulteFire Alliance driving the standardization of PHY/MAC/MPS specifications. He holds a M.S. and Ph.D. in EE from the University of Wisconsin – Madison.
–Distinguished Member of Technical Staff
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XCOM Labs Vice President of Engineering Daaman Hejmadi brings extensive executive leadership and engineering experience to the team. His work has spanned semiconductor startups to device manufacturing giants over the past three decades. He most recently co-founded a startup company building the brain of an autonomous automobile focused on the rapidly growing market in China. Prior to this, Daaman’s most recent tour with Intel began in 2016 culminating in the role of Corporate Vice President & Infrastructure and Platform Solutions Group General Manager propelling the recovery of process technology leadership by creating a development platform for internal and external customers. This was preceded by nine years with Qualcomm in the capacity of Vice President of Engineering revolutionizing their development landscape, transforming their Bangalore design center from a small augmentation team to an engineering powerhouse comprised of ~4K staff that continues to deliver long-term value.
Daaman holds a Master of Business Administration in Organizational Behavior and Finance from the University of California, Berkeley, and a Master of Science in Computer Science and Engineering from the University of Massachusetts. He earned his Bachelor of Engineering (Computer Science and Engineering) at the Indian Institute of Science preceded by a Bachelor of Science in Physics/Electronics from the Sri Sathya Sai Institute of Higher Learning.
–Distinguished Member of Technical Staff.
XCOM Labs Vice President of Multimedia and Applications Serafin Diaz is a brilliant engineer and multimedia whiz who previously acted as Vice President of Engineering at Qualcomm leading XR Research. His work in XR started in 2007 when he jump-started the first Augmented Reality project. This project produced core real time Computer Vision technology which enabled not only XR but also became foundational to projects in robotics and autonomous driving. The inside-out 6DoF head tracking technology showcased in Qualcomm’s VR HMD reference design is an example of such technology. Serafin’s work influenced new generations of HW accelerators in Qualcomm’s SoCs.
He also led a variety of projects in areas concerning 2G CDMA data systems, test automation platforms for wireless devices, physical layer system integration and test for 1xEVDO as well as projects which laid down core technology for wireless VoIP and Video Telephony systems.
Serafin has been a digital hardware designer, a LAN systems engineer, a software architect, and a system validation engineer for TDMA cellular systems at Bell Northern Research (Nortel). He holds more than 60 active and pending US patents. Additionally, he has been recognized as one of the 20 most influential Latinos in tech in 2017 and 2018.
–Distinguished Member of Technical Staff.
Previously an SVP of Technology and Fellow at Qualcomm, XCOM Labs Chief Scientist Peter Black has worked on wireless system designs spanning 2G/3G/4G/5G. He contributed to all aspects of the life cycle of new innovations, starting with the concept, system design, prototype, evangelization, standardization, and finally the commercial ASIC realizations. He was a modem system architect in 1995 for the first commercial CDMA modem chip – the foundational Qualcomm chip-set product. In 1998, Peter co-led an R&D project which led to the high-speed Mobile Internet starting with 1xEV-DO. Concepts such as shared downlink, adaptive HARQ, link adaption, carrier-state feedback, fairness scheduling, carrier aggregation and cellular broadcast were designed, prototyped, standardized, and commercialized over the next 10 years under his direct technical leadership. The 3GPP HSDPA standard was motivated by and based on this foundational EVDO work. He holds 200+ US patents and holds a B.E. in EE from University of Queensland and was awarded a University Medal. He was also awarded a Fulbright Traveling Scholarship and attended Stanford University graduating with an M.S. and Ph.D. in Electrical Engineering.
–Distinguished Member of Technical Staff